Congressman Landsman Announces $24M in CHIPS and Science Act Funding for University of City-Partnered Midwest Microelectronics Consortium Hub

Cincinnati, OH – Today, Congressman Greg Landsman (OH-01) announced the U.S. Department of Defense has awarded $24.3 million in federal CHIPS and Science Act funding for the Midwest Microelectronics Consortium Hub, of which the University of Cincinnati is a partner.

The U.S. Department of Defense has awarded the Midwest Microelectronics Consortium Hub $24.3 million in federal CHIPS and Science Act funding. The Midwest Microelectronics Consortium Hub – a network that includes the University of Cincinnati, midwestern colleges and universities, and the private sector – is focused on accelerating research, development, and advancement of practical applications of semiconductor and microelectronic technologies for the benefit of industrial and national security purposes.

Signed into law in 2022, the Creating Helpful Incentives to Produce Semiconductors and Science Act – or CHIPS and Science Act – is bipartisan legislation designed to turbocharge the domestic semiconductor and microelectronic industry, which for years has been predominantly based in foreign countries.

In April, Congressman Landsman joined 14 Republicans and Democrats from Ohio’s congressional delegation in a letter to the U.S. Department of Defense in support of the Midwest Microelectronics Consortium Hub.

“The University of Cincinnati is helping lead a transformational effort to return the semiconductor and microelectronic sector to the United States,” said Congressman Landsman. “Through the bipartisan CHIPS and Science Act, more than $24 million will be leveraged to strengthen domestic manufacturing, create good-paying jobs, and position our region as a global leader in this growing and exciting sector. On top of that, we’re continuing to work with our congressional colleagues and the University of Cincinnati to bring nearly $1 million in additional Community Project Funding home to support UC’s Semiconductor and Microelectronics Workforce Development program.”

“This meaningful investment helps assure that the University of Cincinnati and our Midwest partners remain on the leading edge of innovation,” said Neville G. Pinto, President of the University of Cincinnati. “It also further prepares our students to fill the critical talent needs in the semiconductor and microelectronics industry.”

In addition to private sector partners, the Midwest Microelectronics Consortium Hub includes the University of Cincinnati, Ohio State University, Case Western Reserve University, University of Dayton, Columbus State Community College, Lorain County Community College, Michigan State University, Purdue University, Sinclair Community College, University of Michigan, University of Notre Dame, and Wright State University.

More information on the U.S. Department of Defense’s award to the Midwest Microelectronics Consortium Hub can be found here. More information on the Midwest Microelectronics Consortium Hub can be found here.

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